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Freescale Semiconductor Technical Data
MPX4250A Rev 6, 12/2006
Integrated Silicon Pressure Sensor Manifold Absolute Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
The MPX4250A/MPXA4250A series Manifold Absolute Pressure (MAP) sensor for engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each cylinder. The MPX4250A/MPXA4250A series piezoresistive transducer is a state-ofthe-art monolithic silicon pressure sensor designed for a wide range of applications, particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, thin-film metallization and bipolar processing to provide an accurate, high-level analog output signal that is proportional to the applied pressure. The small form factor and high reliability of on-chip integration make the Freescale sensor a logical and economical choice for the automotive system engineer. Features * * * * * * * * * 1.5% Maximum Error Over 0 to 85C Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems Patented Silicon Shear Stress Strain Gauge Temperature Compensated Over -40 to +125C Offers Reduction in Weight and Volume Compared to Existing Hybrid Modules Durable Epoxy Unibody Element or Thermoplastic Small Outline, Surface Mount Package Ideal for Non-Automotive Applications Turbo Boost Engine Control Ideally Suited for Microprocessor or Microcontroller-Based Systems ORDERING INFORMATION
Device Type Options Case No. MPX Series Order Number
MPXA4250A6U MPXA4250A6T1 MPXA4250AC6U MPXA4250AC6T1 MPX4250A MPX4250AP
MPX4250A MPXA4250A SERIES
INTEGRATED PRESSURE SENSOR 20 TO 250 kPA (2.9 TO 36.3 psi) 0.2 TO 4.9 V OUTPUT SMALL OUTLINE PACKAGES
MPXA4250A6U/6T1 CASE 482-01
MPXA4250AC6U/C6T1 CASE 482A-01
SMALL OUTLINE PACKAGE PIN NUMBERS
1 2 3 4 N/C(1), (2) VS GND VOUT 5(2) 6 7
(2) (2)
N/C N/C N/C N/C
8
1. Pin 1 in noted by the notch in the lead. 2. Pins 1, 5, 6, and 7 are internal device connections. Do not connect to external circuitry or ground.
Typical Applications
UNIBODY PACKAGES
Packing Options
Rails Tape & Reel Rails Tape & Reel -- --
Device Marking
MPXA4250A MPXA4250A MPXA4250A MPXA4250A
SMALL OUTLINE PACKAGE(1) (MPXA4250A SERIES)
Basic Absolute, Element Only Elements Ported Absolute, Axial Port Elements 482 482 482A 482A 867 867B
MPX4250A CASE 867-08 MPX4250AP CASE 867B-04
UNIBODY
PACKAGE(2)
(MPX4250A SERIES)
MPX4250A MPX4250AP
UNIBODY PACKAGE PIN NUMBERS
1 2 3 VOUT(1) GND VS 4 5 6 N/C(2) N/C(2) N/C(2)
Basic Absolute, Element Only Element Ported Absolute, Ported Elements
1. The MPXA4250A series pressure sensors are available in the basic element package or with pressure port fitting. Two packing options are offered for each type. 2. The MPX4250A series pressure sensors are available in the basic element package or with pressure port fittings providing mounting ease and barbed hose connections.
1. Pin 1 in noted by the notch in the lead. 2. Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground.
(c) Freescale Semiconductor, Inc., 2006. All rights reserved.
VS
Sensing Element
Thin Film Temperature Compensation and Gain Stage #1
Gain Stage #2 and Ground Reference Shift Circuitry
VOUT
GND
Pins 4, 5, and 6 are NO CONNECTS for unibody Device Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package device.
Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings(1)
Rating Maximum Pressure(2) (P1 > P2) Storage Temperature Operating Temperature 1. TC = 25C unless otherwise noted. 2. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Symbol PMAX TSTG TA Value 1000 -40 to +125 -40 to +125 Unit kPa C C
MPX4250A 2 Sensors Freescale Semiconductor
Table 2. Operating Characteristics (VS = 5.1 VDC, TA = 25C unless otherwise noted, P1 > P2, Decoupling circuit shown in Figure 3 required to meet electrical specifications.)
Characteristic Differential Pressure Range(1) Supply Voltage(2) Supply Current Minimum Pressure Offset(3) @ VS = 5.1 Volts Full Scale Output(4) @ VS = 5.1 Volts Full Scale Span(5) @ VS = 5.1 Volts Accuracy(6) Sensitivity Response Time(7) Output Source Current at Full Scale Output Warm-Up Time(8) Offset Stability(9) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: * Linearity: * * * * * Output deviation at any temperature from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C. Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25C. (0 to 85C) Symbol POP VS IO VOFF Min 20 4.85 -- 0.133 Typ -- 5.1 7.0 0.204 Max 250 5.35 10 0.264 Units kPa VDC mAdc VDC
(0 to 85C)
VFSO
4.826
4.896
4.966
VDC
(0 to 85C)
VFSS
--
4.692
--
VDC
(0 to 85C)
-- V/ tR IO + -- --
-- -- -- -- -- --
-- 20 1.0 0.1 20 0.5
1.5 -- -- -- -- --
%VFSS mV/kPa msec mAdc msec %VFSS
7. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized. 9. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
Table 3. Mechanical Characteristics
Characteristics Weight, Basic Element (Case 867) Weight, Small Outline Package (Case 482) Typ 4.0 1.5 Unit Grams Grams
MPX4250A Sensors Freescale Semiconductor 3
+5 V FloroSilicone Die Coat Wire Bond Die P1 Stainless Steel Metal Cover Epoxy Case Vout Vs IPS 470 pF
OUTPUT
Lead Frame Sealed Vacuum Reference
P2
RTV Die Bond
1.0 F
0.01 F
GND
Figure 2. Cross Sectional Diagram (Not to Scale) Figure 2 illustrates the absolute pressure sensing chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX4250A/MPXA4250A series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability.
Figure 3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646. Contact the factory for information regarding media compatibility in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over temperature range of 0 to 85C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range.
5.0 4.5 4.0 3.5 Output (Volts) 3.0 2.5 2.0 1.5 1.0 0.5 0 MIN Transfer Function: VOUT = Vs* (0.004 x P-0.04) Error VS = 5.1 Vdc TEMP = 0 to 85C
MAX
TYP
MPX4250A 4 Sensors Freescale Semiconductor
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200 210 220 230 240 250 260 Pressure (ref: to sealed vacuum) in kPa
Figure 4. Output vs. Absolute Pressure
Transfer Function
Nominal Transfer Value:
VOUT = VS (P x 0.004 - 0.04) (Pressure Error x Temp. Factor x 0.004 x VS) VS = 5.1 V 0.25 VDC
Temperature Error Band
4.0 3.0 Temperature Error Factor 2.0 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in C NOTE: The Temperature Multiplier is a linear response from 0x to -40C and from 85 to 125C. Temp - 40 0 to 85 +125 Multiplier 3 1 3
Pressure Error Band
5.0 4.0 3.0 2.0 1.0 0 -1.0 -2.0 -3.0 -4.0 -5.0
Pressure Error (kPa)
0
25
50
75 100 125 150 175 200 225 250
Pressure (kPa)
Pressure 20 to 250 kPa
Error (Max) 3.45 (kPa)
MPX4250A Sensors Freescale Semiconductor 5
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total solder reflow process. It is always recommended to design design. The footprint for the surface mount packages must be boards with a solder mask layer to avoid bridging and the correct size to ensure proper solder connection interface shorting between solder pads. between the board and the package. With the correct Footprint, the packages will self align when subjected to a
0.100 TYP 8X 2.54
0.660 16.76
0.060 TYP 8X 1.52
0.300 7.62
0.100 TYP 8X 2.54
inch mm
SCALE 2:1
Figure 5. SOP Footprint (Case 482)
MPX4250A 6 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
-A4 5
D 8 PL 0.25 (0.010)
M
TB
S
A
S
-BG
8 1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 10.29 10.54 18.01 18.41
S
N C H -TPIN 1 IDENTIFIER SEATING PLANE
J K M
DIM A B C D G H J K M N S
CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE
-A4 5
D
8 PL
0.25 (0.010)
M
TB
S
A
S
N
-BG
8 1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17
S
W
V C H J K M
PIN 1 IDENTIFIER
-TSEATING PLANE
DIM A B C D G H J K M N S V W
CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE
MPX4250A Sensors Freescale Semiconductor 7
PACKAGE DIMENSIONS
C R M B -AN
PIN 1 SEATING PLANE
1 2 3 4 5 6
POSITIVE PRESSURE (P1)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630).
INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.027 0.033 0.68 0.84 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.40 0.014 0.016 0.36 0.695 0.725 17.65 18.42 30 NOM 30 NOM 0.475 0.495 12.07 12.57 0.430 0.450 10.92 11.43 0.090 0.105 2.29 2.66
L
-TG F D 6 PL 0.136 (0.005)
M
J S
TA
M
DIM A B C D F G J L M N R S OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN
STYLE 1: PIN 1. 2. 3. 4. 5. 6.
VOUT GROUND VCC V1 V2 VEX
STYLE 2: PIN 1. 2. 3. 4. 5. 6.
OPEN GROUND -VOUT VSUPPLY +VOUT OPEN
STYLE 3: PIN 1. 2. 3. 4. 5. 6.
CASE 867-08 ISSUE N UNIBODY PACKAGE
MPX4250A 8 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 867B-04 ISSUE G UNIBODY PACKAGE
MPX4250A Sensors Freescale Semiconductor 9
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 867B-04 ISSUE G UNIBODY PACKAGE
MPX4250A 10 Sensors Freescale Semiconductor
NOTES
MPX4250A Sensors Freescale Semiconductor 11
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MPX4250A Rev. 6 12/2006

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